Plasma processing apparatus and plasma processing method
US9583355B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2014 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Apr 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The plasma processing apparatus is provided with a chamber 11, a plasma source 13 which generates plasma inside the chamber 11, a stage 16 which is provided inside the chamber 11 and places a carrier 5 thereon, a cover 31 which is arranged above the stage 16 to cover a holding sheet 6 and a frame 7 and has a window 33 which is formed on a central part thereof to penetrate the cover 31 in the thickness direction, and a drive mechanism 38 which changes the position of the cover 31 relative to the stage 16 between a first position which is away from the stage 16 and allows the carrier 5 to be placed on and removed from the stage 16 and a second position which allows the cover 31 to cover the holding sheet 6 and the frame 7 of the carrier 5 placed on the stage 16 and a substrate 2 held on the holding sheet 6 to be exposed through the window 33. The window 33 of the cover 31 allows an area of the substrate 2, the area being located on the inner side with respect to an outer edge area of the substrate 2, to be exposed therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.