Reducing directional stress in an orthotropic encapsulation member of an electronic package
US9583408B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2015 |
| Grant date | Feb 28, 2017 |
| Priority date | — |
| Expiry date | Aug 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3737
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses for reducing directional stress in an orthotropic encapsulation member of an electronic package may include attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip and a plurality of opposing sidewalls, electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening, and thermally contacting a directional heat spreader to the semiconductor chip, the directional heat spreader transferring heat from the semiconductor chip, wherein the directional heat spreader is shaped to reduce a directional stress along the opposing bivector direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.