Semiconductor packaging containing sintering die-attach material

US9583453B2 · kind B2 · utility

Assignee

• Ormet Circuits, Inc. · US

Inventors

• Catherine Shearer · San Marcos, US
• Michael Matthews · Encinitas, US
• Peter A Matturi · Del Mar, US
• Eunsook Barber · San Diego, US
• Richard R. Weaver · Poway, US

Key dates

• Filing date: May 30, 2013
• Grant date: Feb 28, 2017
• Expiry date: Dec 21, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15747
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.