Apparatus and method for efficient materials use during substrate processing
US9589769B2 · kind B2 · utility
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2References
13Claims
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Key dates
| Filing date | Aug 20, 2014 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Aug 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32623
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A processing apparatus may include a plasma chamber to house a plasma; and an extraction assembly disposed along a side of the plasma chamber. The extraction assembly may be configured to direct ions from the plasma to a substrate, wherein the ions generate etched species comprising material that is etched from the substrate; and wherein the extraction assembly comprises at least one component having a recess that faces the substrate and is configured to intercept and retain the etched species.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.