Mounting table and plasma processing apparatus
US9589823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2012 |
| Grant date | Mar 7, 2017 |
| Priority date | — |
| Expiry date | Sep 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/683
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting table includes an electrostatic chuck, a base, and a cylindrical sleeve. The electrostatic chuck has a top surface to be exposed to plasma and a bottom surface opposite to the top surface, and a first through-hole is formed through the electrostatic chuck. The base is bonded to the bottom surface of the electrostatic chuck by a first adhesive, and a second through-hole is formed through the base. The second through-hole communicates with the first through-hole and has a diameter larger than a diameter of the first through-hole. The sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.