Patent · US Active

Apparatus comprising and a method for manufacturing an embedded MEMS device

US9593009B2 · kind B2 · utility

42Cited by

7References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edward Fuergut · Nuremberg, DE
Horst Theuss · Wenzenbach, DE
Rainer Leuschner · Regensburg, DE

Key dates

Filing date	Oct 15, 2014
Grant date	Mar 14, 2017
Priority date	—
Expiry date	Oct 15, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2201/003
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.