Measuring form changes of a substrate
US9595094B2 · kind B2 · utility
1Cited by
7References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2011 |
| Grant date | Mar 14, 2017 |
| Priority date | — |
| Expiry date | Jun 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a device and method for determining changes in the shape of a substrate parallel to its substrate surface. The device comprises The device is able to determine distances (dx1, dy1, dx2, dy2, dxn, dyn) of images of the structures and/or changes of the distances (dx1, dy1, dx2, dy2, dxn, dyn).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.