Apparatus for treating surfaces of wafer-shaped articles
US9597701B2 · kind B2 · utility
1Cited by
17References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2013 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Feb 3, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, and is adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber. The lid comprises an annular chamber, gas inlets communicating with the annular chamber and opening on a surface of the lid facing outwardly of the closed process chamber, and gas outlets communicating with the annular chamber and opening on a surface of the lid facing inwardly of the closed process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.