High power radio frequency (RF) in-line wafer testing

US9599657B2 · kind B2 · utility

Assignee

• GlobalFoundries Inc. · KY

Inventors

• Hanyi Ding · Colchester, US
• John Ferrario · Waterbury, US
• Barton E. Green · Colchester, US
• Stephen Moss · Troy, US
• Mustapha Slamani · South Burlington, US

Key dates

• Filing date: Jan 3, 2013
• Grant date: Mar 21, 2017
• Expiry date: Jan 23, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/06772
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Approaches for performing in line wafer testing are provided. An approach includes a method that includes generating a radio frequency (RF) test signal, and applying the RF test signal to a device under test (DUT) in a wafer using a buckling beam probe set with a predefined pitch. The method also includes detecting an output RF signal from the DUT in response to the applying the RF test signal to the DUT, and sensing at least one frequency component of the detected output RF signal.