Electronic package and fabrication method thereof
US9601403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2015 |
| Grant date | Mar 21, 2017 |
| Priority date | — |
| Expiry date | Dec 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided, which includes: a first circuit structure; at least first electronic element disposed on a surface of the first circuit structure; at least a first conductive element formed on the surface of the first circuit structure; a first encapsulant encapsulating the first electronic element and the first conductive element; and a second circuit structure formed on the first encapsulant and electrically connected to the first conductive element. By directly disposing the electronic element having high I/O functionality on the circuit structure, the invention eliminates the need of a packaging substrate having a core layer and thus reduces the thickness of the electronic package. The invention further provides a method for fabricating the electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.