Magnetic contacts

US9601468B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Michael P. Skinner · San Jose, US
• Teodora Ossiander · Sinzing, DE
• Sven Albers · Regensburg, DE
• Georg Seidemann · Landshut, DE

Key dates

• Filing date: May 4, 2016
• Grant date: Mar 21, 2017
• Expiry date: May 4, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2225/06596
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.