Patent · US Active

Electronic assembly that includes a plurality of electronic packages

US9603276B2 · kind B2 · utility

1Cited by

6References

22Claims

0Family size

Assignee

Intel Corporation · US

Inventors

David J. Llapitan · Tacoma, US
Jeffory L. Smalley · East Olympia, US
Gaurav Chawla · Tempe, US
Joshua D. Heppner · Chandler, US
Vijaykumar Krithivasan · Chandler, US
Jonathan W. Thibado · Beaverton, US
Kuang Liu · Queen Creek, US
Gregorio R. Murtagian · Phoenix, US

Key dates

Filing date	Dec 26, 2014
Grant date	Mar 21, 2017
Priority date	—
Expiry date	Dec 26, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/1084
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.