Patent · US Active

Micromechanical sensor device

US9606141B2 · kind B2 · utility

0Cited by
5References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 6, 2014
Grant dateMar 28, 2017
Priority date
Expiry dateApr 20, 2035

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49002
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.