Micromechanical sensor device
US9606141B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2014 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Apr 20, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.