Package structure and fabrication method thereof
US9607974B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Nov 13, 2015 |
| Grant date | Mar 28, 2017 |
| Priority date | — |
| Expiry date | Nov 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a package structure is provided, which includes: providing a first carrier having a circuit layer thereon; forming a plurality of conductive posts on the circuit layer and disposing at least an electronic element on the first carrier; forming an encapsulant on the first carrier to encapsulate the conductive posts, the circuit layer and the electronic element; and removing the first carrier, thereby dispensing with the conventional hole opening process for forming the conductive posts and hence reducing the fabrication costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.