Integration of absorption based heating bake methods into a photolithography track system
US9613801B2 · kind B2 · utility
448Cited by
15References
18Claims
0Family size
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Key dates
| Filing date | Sep 18, 2015 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Sep 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of patterning a layered substrate is provided that includes forming a layer of a block copolymer on a substrate, annealing the layer of the block copolymer to affect microphase segregation such that self-assembled domains are formed, and annealing the layer of the block copolymer a second time to refine or modify the microphase segregation, where one of the annealing steps uses an absorption based heating method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.