Apparatus and method for bonding substrates
US9613840B2 · kind B2 · utility
11Cited by
2References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 22, 2011 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | Feb 14, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface. The mounting apparatus has an outer ring section for controllable fixing of the first substrate. Deformation means are provided for controllable deformation of the first substrate. The deformation means act within the outer ring section. Bonding means are provided for bonding of the first substrate with the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.