Patent · US Active

Pad design for electrostatic chuck surface

US9613846B2 · kind B2 · utility

3Cited by

5References

9Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Govinda Raj · Kanchinakote, IN
Cheng-Hsiung Tsai · Cupertino, US
Robert T. Hirahara · San Jose, US
Kadthala Ramaya Narendrnath · San Jose, US
Manjunatha Koppa · Kanchinakote, IN
Ross Marshall · Campbell, US

Key dates

Filing date	Nov 21, 2014
Grant date	Apr 4, 2017
Priority date	—
Expiry date	Apr 17, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24314
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.