Semiconductor device having improved heat-dissipation characteristics
US9613881B2 · kind B2 · utility
11Cited by
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21Claims
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Key dates
| Filing date | May 9, 2014 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | May 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.