Semiconductor device
US9613966B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2015 |
| Grant date | Apr 4, 2017 |
| Priority date | — |
| Expiry date | May 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/34
Abstract
A semiconductor device includes a semiconductor substrate including a plurality of active areas, a bit line crossing the plurality of active areas, a direct contact connecting a first active area of the plurality of active areas with the bit line, an insulating spacer covering a side wall of the bit line and extending at a level lower than a level of an upper surface of the semiconductor substrate, a contact pad connected with a side wall of a second active area of the plurality of active areas, which neighbors the first active area, a first insulating pattern defining a contact hole exposing the insulating spacer and the contact pad, and a buried contact connected with the contact pad and filling the contact hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.