Integrated circuit chip cooling device

US9615443B2 · kind B2 · utility

Assignees

• STMicroelectronics (Crolles 2) SAS · FR
• STMicroelectronics SA
• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Stephane Monfray · Eybens, FR
• Sandrine Lhostis · Theys, FR
• Christophe Maitre · Barraux, FR
• Olga Kokshagina · Paris, FR
• Philippe Coronel · Barraux, FR

Key dates

• Filing date: Sep 16, 2014
• Grant date: Apr 4, 2017
• Expiry date: Jun 20, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

An integrated circuit chip cooling device includes a network of micropipes. A first pipe portion and a second pipe portion of the network are connected by at least one valve. The valve is formed of a bilayer strip. In response to change in temperature, the shape of the bilayer strip changes to move the valve from a substantially closed position to an open position. In one configuration, the change is irreversible. In another configuration, the change is reversible in response to an opposite change in temperature.