Substrate processing method, substrate processing apparatus, and computer-readable storage medium stored with substrate processing program
US9627192B2 · kind B2 · utility
0Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2015 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Jul 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.