Methods for bonding substrates
US9627231B2 · kind B2 · utility
4Cited by
1References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2013 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | May 20, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24851
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.