Patent · US Active

Thinning in package using separation structure as stop

US9627287B2 · kind B2 · utility

148Cited by

6References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Engelhardt · Feldkirchen-Westerham, DE
Edward Fuergut · Nuremberg, DE
Hannes Eder · Villach, AT

Key dates

Filing date	Oct 18, 2013
Grant date	Apr 18, 2017
Priority date	—
Expiry date	Oct 30, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.