Patent · US Active

Semiconductor module with interlocked connection

US9627305B2 · kind B2 · utility

2Cited by

8References

3Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Georg Meyer-Berg · Birkenfeld, DE
Reinhard Pufall · Birkenfeld, DE
Michael Goroll · Poing, DE
Rainer Dudek · Chemnitz, DE

Key dates

Filing date	Jul 11, 2013
Grant date	Apr 18, 2017
Priority date	—
Expiry date	Jul 11, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/35121
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a support substrate having opposing first and second main surfaces and sides between the first and second main surfaces, a semiconductor die attached to one of the main surfaces of the support substrate, and an encapsulation material at least partly covering the support substrate and the semiconductor die. A protrusion extends outward from a side of the support substrate and terminates in the encapsulation material. The protrusion forms an interlocked connection with the encapsulation material. The interlocked connection increases the tensile strength of the interface between the encapsulation material and the side of the support substrate with the protrusion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.