Method for applying a bonding layer
US9627349B2 · kind B2 · utility
2Cited by
0References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 13, 2013 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Sep 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.