Semiconductor device and a method for forming a semiconductor device
US9628918B2 · kind B2 · utility
2Cited by
0References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 25, 2013 |
| Grant date | Apr 18, 2017 |
| Priority date | — |
| Expiry date | Mar 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die. The microphone module includes a movable microphone element arranged at a main side of the first semiconductor die and the second semiconductor die is mounted to the main side of the first semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.