Semiconductor device including leadframe with a combination of leads and lands and method
US9631481B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2016 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Oct 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device includes a die pad, a plurality of first lands each having a first land first top recessed portion disposed on a first land first end distal to the die pad, and a plurality of second lands each having a second land first bottom recessed portion disposed on a second land first end distal to the die pad. A semiconductor die is electrically connected to the first and second lands. A package body, which defines a bottom surface and a side surface, at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in and substantially flush with the bottom surface of the package body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.