Light emitting device
US9634216B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 8, 2014 |
| Grant date | Apr 25, 2017 |
| Priority date | — |
| Expiry date | Aug 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
According to one embodiment of the present invention, the light emitting device includes an LED element, a side wall which surrounds the LED element, a phosphor layer which is fixed to the side wall with an adhesive layer therebetween, and is positioned above the LED element, and a metal pad as a heat dissipating member. The side wall includes an insulating base which surrounds the LED element and a metal layer which is formed on a side surface at the LED element side of the base, and is in contact with the metal pad and the adhesive layer. The adhesive layer includes a resin layer that includes a resin containing particles which have higher thermal conductivity than the resin or a layer that includes solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.