Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes
US9636714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2015 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Jun 19, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7728
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes are disclosed. An article such as an annular body may be formed by a compression molding technique. By including a patterned surface as part of an outer circumferential surface of the annular body, frictional contact between the annular body and the substrate may be enhanced as friction-reducing fluids associated with a wet chemical processes may be directed away from the desired friction contact area between the annular body and the substrate. In this manner, frictional contact may be enhanced and the substrate may be effectively positioned and moved during the wet chemical process to improve the effectively of the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.