Integrated circuits and methods for their fabrication
US9640423B2 · kind B2 · utility
7Cited by
16References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2015 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Jul 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76883
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Integrated circuits and methods for producing the same are provided. In accordance with one embodiment a method of producing an integrated circuit includes forming a trench defined by a first material. The trench is filled with a second material to produce a gap defined within the second material, where the second material is in a solid state. The second material is reflowed within the trench to reduce a volume of the gap, and the second material is then solidified within the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.