Patent · US Active

Semiconductor device including a solder barrier

US9640459B1 · kind B1 · utility

1Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Wee Boon Tay · Melaka City, MY
Kuan Ching Woo · Tampin, MY
Paul Armand Asentista Calo · Melaka City, MY

Key dates

Filing date	Jan 4, 2016
Grant date	May 2, 2017
Priority date	—
Expiry date	Jan 4, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.