Matrix lid heatspreader for flip chip package
US9640469B2 · kind B2 · utility
0Cited by
29References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2015 |
| Grant date | May 2, 2017 |
| Priority date | — |
| Expiry date | Sep 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.