Method of releasably attaching a semiconductor substrate to a carrier
US9644118B2 · kind B2 · utility
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11References
10Claims
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Key dates
| Filing date | Mar 3, 2015 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Mar 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13647
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.