Methods and media for averaging contours of wafer feature edges
US9646220B2 · kind B2 · utility
3Cited by
4References
18Claims
0Family size
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Key dates
| Filing date | Nov 25, 2013 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Apr 10, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of determining an average contour of a patterned feature on a wafer includes providing a reference contour corresponding to the patterned feature on the wafer, providing a plurality of images of the patterned feature, extracting from the plurality of images a plurality of extracted contours that represent the patterned feature, eliminating flyers from the plurality of extracted contours, and generating the average contour of the patterned feature based on the extracted contours remaining after elimination of the flyers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.