Method for fabricating a composite structure to be separated by exfoliation
US9646825B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2012 |
| Grant date | May 9, 2017 |
| Priority date | — |
| Expiry date | Jul 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for fabricating a composite structure comprising a layer to be separated by irradiation, the method comprising the formation of a stack containing: a support substrate formed from a material that is at least partially transparent at a determined wavelength; a layer to be separated; and a separation layer interposed between the support substrate and the layer to be separated, the separation layer being adapted to be separated by exfoliation under the action of radiation having a wavelength corresponding to the determined wavelength. Furthermore, the method comprises, during the step for forming the composite structure, a treatment step modifying the optical properties in reflection at an interface between the support substrate and the separation layer or on an upper face of the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.