Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip

US9646856B2 · kind B2 · utility

Assignee

• Intel Deutschland GmbH · DE

Inventors

• Thorsten Meyer · Regensburg, DE
• Klaus Reingruber · Langquaid, DE
• David O'Sullivan · Ottobrunn, DE

Key dates

• Filing date: May 19, 2015
• Grant date: May 9, 2017
• Expiry date: May 19, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/2064
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.