Patent · US Active

Plasma-based material modification using a plasma source with magnetic confinement

US9653253B2 · kind B2 · utility

1Cited by
10References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 7, 2014
Grant dateMay 16, 2017
Priority date
Expiry dateMar 13, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/083
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A plasma-based material modification system for material modification of a work piece may include a plasma source chamber coupled to a process chamber. A support structure, configured to support the work piece, may be disposed within the process chamber. The plasma source chamber may include a first plurality of magnets, a second plurality of magnets, and a third plurality of magnets that surround a plasma generation region within the plasma source chamber. The plasma source chamber may be configured to generate a plasma having ions within the plasma generation region. The third plurality of magnets may be configured to confine a majority of electrons of the plasma having energy greater than 10 eV within the plasma generation region while allowing ions from the plasma to pass through the third plurality of magnets into the process chamber for material modification of the work piece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.