High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella
US9653260B2 · kind B2 · utility
3Cited by
14References
26Claims
0Family size
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Key dates
| Filing date | Nov 30, 2012 |
| Grant date | May 16, 2017 |
| Priority date | — |
| Expiry date | Apr 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.