Stiffened wires for offset BVA
US9659848B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2016 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Mar 31, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A component can include a generally planar element, a reinforcing dielectric layer overlying the generally planar element, an encapsulation overlying the reinforcing dielectric layer, and a plurality of wire bonds. Each wire bond can have a tip at a major surface of the encapsulation. The wire bonds can have first portions extending within the reinforcing dielectric layer. The first portions of at least some of the wire bonds can have bends that change an extension direction of the respective wire bond. The reinforcing dielectric layer can have protruding regions surrounding respective ones of the wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions. The peak heights of the protruding regions can coincide with points of contact between the reinforcing dielectric layer and individual wire bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.