Solder-on-die using water-soluble resist system and method
US9659889B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Dec 20, 2013 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Dec 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble resist coating, the water-soluble resist coating being on a surface of an initial assembly. The initial assembly may include an electronic component. The surface may be formed, at least in part, by an electrical terminal of the electronic component, the hole being aligned, at least in part, with the electrical terminal. The solder may be reflowed, wherein the solder couples, at least in part, with the electrical terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.