Die warpage control for thin die assembly
US9659899B2 · kind B2 · utility
2Cited by
0References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 10, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Jul 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Die warpage is controlled for the assembly of thin dies. In one example, a semiconductor die has a back side and a front side opposite the back side. The back side has a semiconductor substrate and the front side has components formed over the semiconductor substrate in front side layers. A backside layer is formed over the backside of the semiconductor die to resist warpage of the die when the die is heated and a plurality of contacts are formed on the front side of the die to attach to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.