Systems and methods for package on package through mold interconnects
US9659908B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Nov 10, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Discussed generally herein are methods and devices for more reliable Package on Package (PoP) Through Mold Interconnects (TMIs). A device can include a first die package including a first conductive pad on or at least partially in the first die package, a dielectric mold material on the first die package, the mold material including a hole therethrough at least partially exposing the pad, a second die package including a second conductive pad on or at least partially in the second die package the second die package on the mold material such that the second conductive pad faces the first conductive pad through the hole, and a shape memory structure in the hole and forming a portion of a solder column electrical connection between the first die package and the second die package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.