Package structure and manufacturing method thereof
US9659911B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2016 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Sep 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure and a manufacturing method thereof are provided. The package structure includes a redistribution layer (RDL), at least one first die, a plurality of conductive terminals and solder balls, a first encapsulant, a plurality of second dies, and a second encapsulant. The RDL has a first surface and a second surface opposite to the first surface. The first die and the conductive terminals are electrically connected to the RDL and are located on the first surface of the RDL. The first encapsulant encapsulates the first die and the conductive terminals. The first encapsulant exposes part of the conductive terminals. The solder balls are electrically connected to the conductive terminals and are located over the conductive terminals exposed by the first encapsulant. The second dies are electrically connected to the RDL and are located on the second surface of the RDL. The second encapsulant encapsulates the second dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.