Apparatuses and methods for forming die stacks
US9659917B1 · kind B1 · utility
4Cited by
1References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 11, 2015 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Dec 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatuses and methods for forming die stacks are disclosed herein. An example method includes dispensing a temporary adhesive onto a substrate, placing a base die onto the temporary adhesive, curing the temporary adhesive, forming a die stack that includes the base die, activating a release layer disposed on the substrate, wherein the release layer is between the substrate and the temporary adhesive, removing the die stack from the substrate, and removing the temporary adhesive from the die stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.