Integrated MEMS microphone and vibration sensor
US9661411B1 · kind B1 · utility
28Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2016 |
| Grant date | May 23, 2017 |
| Priority date | — |
| Expiry date | Jan 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.