Substrate processing apparatus, substrate processing method, fluid supplying method and storage medium
US9662685B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2013 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Jan 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a substrate processing apparatus including: a processing chamber configured to process a substrate; a fluid supply source configured to supply a substrate processing fluid used in processing for the substrate in a predetermined pressure; a constant pressure supplying path configured to supply the substrate processing fluid from the fluid supply source to the processing chamber in a predetermined pressure without boosting the pressure of the substrate processing liquid; a boosted pressure supplying path configured to boost the pressure of the substrate processing fluid from the fluid supply source into a predetermined pressure by a booster mechanism and supply the pressure boosted substrate processing fluid to the processing chamber; and a control unit configured to switch over the constant pressure supplying path and the boosted pressure supplying path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.