Ultrasonic cleaning method and apparatus
US9662686B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 24, 2010 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Jul 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.