Patent · US Active

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

US9663353B2 · kind B2 · utility

29Cited by

0References

16Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Gerald Ofner · Regensburg, DE
Thorsten Meyer · Regensburg, DE
Reinhard Mahnkopf · Oberhaching, DE
Christian Geissler · Teugn, DE
Andreas Augustin · Munich, DE

Key dates

Filing date	Jun 28, 2013
Grant date	May 30, 2017
Priority date	—
Expiry date	Oct 23, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.