Method and apparatus for treating a workpiece with arrays of nozzles
US9666456B2 · kind B2 · utility
1Cited by
98References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2015 |
| Grant date | May 30, 2017 |
| Priority date | — |
| Expiry date | Mar 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.