Sensor device and method for making thereof
US9670057B1 · kind B1 · utility
5Cited by
3References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 29, 2016 |
| Grant date | Jun 6, 2017 |
| Priority date | — |
| Expiry date | Jan 29, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A sensor device may include an electronic device that has at least one integrated circuit device and a MEMS sensor that are each monolithically integrated with a semiconductor substrate. The sensor device may include a suspension structure that suspends the MEMS sensor over a back cavity within the semiconductor substrate. The suspension structure may be springs or a spring structure formed from etching the front side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.